2021

• 06. Completion and expansion/relocation of a new plant for HANA SOLUTION Co., Ltd., the vacuum brazing division
• 06. Machining division TeraTechnology's new plant completion and expansion/relocation scheduled

2020

• Completion and expansion/relocation of a new plant for AMICUS Co., Ltd., the surface treatment division for semiconductors
• 

2018

• 09. Established semiconductor component machining (medium/large) division, TDI Co., Ltd.
• 06. Established semiconductor surface treatment division, AMICUS Co., Ltd.
• 

2016

• 01. Established Brazing Division, HANA SOLUTION Co., Ltd
• 

2011

• Adopted brazing equipment (R&D)
• Notice on expansion and relocation of the surface treatment division

2010

• 03. Established surface treatment division, TOP CHEMITECH Co., Ltd.

2008

• 10. Registered as a member company of KOITA
• 10. Acquired the corporate research institute certificate
• 10. Acquired ISO 14000 & Innobiz certificate
• 10. International patent application for jig for electrostatic chuck assembly
• 04. Built Plant #2 in the location of the head office
• 

2007

• Converted to TERA TECHNOLOGY Co., Ltd.

2006

• Acquired ISO 9001:2000

2005

• 02. Selected as a clean business site

2004

• 01. Built and relocated a new plant of TERA TECHNOLOGY

2003

• 05. Company registration for Korea Semitech
• 05. Company registration for TCK Co., Ltd.
• 05. Company registration for KOMICO
• 05. Established TERA TECHNOLOGY