What is ESC?
TERA TECHNOLOGY Co., Ltd.
It is the place where the substrate(silicon wafer) is placed inside the vacuum chamber of semiconductor and display manufacturing equipment. It is a core part that uses the force of static electricity to fix the substrate to the lower electrode.
(Using the principle that when +,- electricity is applied to the ESC, the opposite electric potential is applied to the object, and a force that attracts each other is generated by the charged electric potential)
Classified into monopolar(unipolar) type and bipolar type according to the number of electrodes used
Mono-Polar ESC
The positive(+) electrode and the negative(-) electrode face each other with a dielectric layer in between.
Bi-Polar ESC
A form in which positive(+) and negative(-) electrodes are alternately arranged in the horizontal direction
| Types | MONOPOLAR ESC | BIPOLAR ESC |
|---|---|---|
| Arrangement | The positive(+) electrode and the negative(-) electrode face each other with a dielectric layer in between. | A form in which positive(+) and negative(-) electrodes are alternately arranged in the horizontal direction |
| Driving mechanism | Chucking object with (+) charge on ESC and plasma (-) charge on chamber | Chucking object by applying (+)(-) charge to ESC |
| Strengths/weaknesses | 1. Easy to manufacture due to simple structure 2. High chucking force 3. Possible damage to the object due to plasma(-) |
1. Difficult to manufacture due to complicated structure 2. Relatively low chucking force 3. No possibility of damage to the object as plasma(-) is not required |
| Module |  |
 |
| Types | Anodizing ESC | Polymide ESC |
|---|---|---|
| Driving mechanism | Bipolar Type | Monopolar Type |
| Diagram |  |
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| Types | APS Coating ESC | Ceramic Sheet ESC |
|---|---|---|
| Driving mechanism | Interdigitated Type | Interdigitated Type |
| Diagram |  |
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